Solder Paste| Current Trends, Business Opportunities and Challenges of Global Market
Solder paste is a material used for the manufacture of printed circuit boards to connect surface mount components to pads on the board. All electronics equipment contains printed circuit boards (PCBs), which are critically important for the satisfactory functioning of the equipment. PCBs have patterns of electrically conducting copper tracks to which electronic components are joined. Solder paste is used to attach the tracks and the components by soldering the components to the copper tracks. Solder pastes are a mixture of a metal alloy powder and a cream-like material made of organic chemicals called flux.
The solder paste market is driven by various factor such as Increasing demand from electronic manufacturing services and rise in production of electronic devices including computers, laptops, smartphones, tablets, televisions, medical testing equipment's, fiber optic receptors, nuclear detection systems, data storage devices and weather analysis equipment in Asia Pacific countries such as China, Korea and India. Globally, China is the largest manufacturer of electronic devices and electronic parts. Thus, China accounted for the largest consumer for solder paste globally. Also, as the electronics industry develops, there is a growing demand to increase the package density of components on a substrate. However, the solder paste market is hampered by the availability of substitute product and stringent government regulations concerning electronic wastes and environment safety.
On the basis of product type, the solder paste market is segmented into rosin based pastes, water soluble pastes and no-clean pastes. The solder paste market on the basis of the application is classified into SMT assembly and semiconductor packaging.
leading industry players with information such as company profiles, components, and services offered, financial information of the last 3 years, the key development in the past five years.
On the basis of product type, the solder paste market is segmented into rosin based pastes, water soluble pastes and no-clean pastes. The solder paste market on the basis of the application is classified into SMT assembly and semiconductor packaging.
leading industry players with information such as company profiles, components, and services offered, financial information of the last 3 years, the key development in the past five years.
- AIM Metals & Alloys LP
- Henkel Corporation
- Indium Corporation
- Inventec
- Kester
- KOKI Company Ltd.
- MacDermid Alpha Electronics Solutions
- Nihon Superior Co., Ltd.
- Senju Metal Industry Co., Ltd.
- TAMURA Corporation

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